REFLOW OVEN REFLOW SOLDERING from China manufacturer - ETA ELECTRONIC EQUIPMENT CO.,LTD

Price:	1000.0 USD
Payment Terms:	T/T,WU,Paypal
Place of Origin:	Guangdong, China (Mainland)


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Product Detail

Model No.: ET

Production Capacity: 3000

Delivery Date: 30DAYS

COLOER: GREY

Means of Transport: Ocean,Land

Packing: WOODEN CASE

Brand Name: ETA

For SMT/DIP factory setup,we can do for you:
1. We provide fulL SMT solution for you
2. We provide core technology with our equipments
3. We provi

LED Assembly Solder Reflow Oven/ Reflow Solder/SMT Machine

Main product: Reflow oven, LED reflow oven, LED assembly machine, SMT reflow oven, SMT mounter, SMT Pick and Place Machine, SMT Placement Machine, SMT Mounting Machine, Elctronic Equipment, PCB Machine, Reflow Oven, Electronic Equipment, SMT Assembly, SMT/SMD Equipment

1, Windows XP O/S, so simply as Chinese and English interface onscreen alternative available.
2, The digital control system adopted with PLC +Modular circuit to stabilized and accurate of repetitive precision.
3, Intelligent diagnosis system (IDS) has the function of trouble remind, alarm, list-out, report saving.
4, Temperature and blower speed controlling adjustable independently, to meet the high-precision requirements.
5, To minimize the temperature difference of various volumes of components by newly chambers design, with enhance the reliability and protective of each solder joints.
6, Step forced cooling system to easily achieve the requirements of strict lead-free processes (cooling slope: ≥ 3degree/sec. )
7, Center support and dual rail is optional.
1, Windows XP O/S, so simply as Chinese and English interface onscreen alternative available.
2, The digital control system adopted with PLC +Modular circuit to stabilized and accurate of repetitive precision.
3, Intelligent diagnosis system (IDS) has the function of trouble remind, alarm, list-out, report saving.
4, Temperature and blower speed controlling adjustable independently, to meet the high-precision requirements.
5, To minimize the temperature difference of various volumes of components by newly chambers design, with enhance the reliability and protective of each solder joints.
6, Step forced cooling system to easily achieve the requirements of strict lead-free processes (cooling slope: ≥ 3degree/sec. )
7, Center support and dual rail is optional.

Model	S8
GENERAL
Outside dimension	531013531490mm
Standard color	Computer grey
Weight	2150kg
Number of heating zones	Up8/bottm8
Lengthof heating zones	3121mm
Number of cooling zones	2(built-in)
Exhaust volume	10M3/min*2 exhausts
Standard feature of control system
Electric supply required	3phase, 380V 50/60Hz
Electric power required	64KW
Power for warm up	32KW
Power consumption	10KW
Heating pattern	Up& Bottom Hot air
Warming time	Approx. 30minute
Temp. setting range	Room temp__300degree
Control system	PLC+ Computer
Temperature control method	PID close loop control +SSR driving
Temperature control precision	± 1.0degree
Temperature deviation on PCB	± 1.5degree
Data storage	Process data and status storage (80GB)
Abnormal alarm	Abnormal temperature(extra-high/extra-low temp)
Board dropped alarm	Tower light: yellow warming: Green-normal: Red-abnormal
Standard features of conveyor system
Max. width of PCB	Max: 450mm(Standard)
Rail Number	1 Lane(standard) 2 Lane (option)
Components clearance	Top/bottom clearance of PCB is 25mm
Conveyor height	Light → right(option: R→ L)
PCB transmission agent	Air-reflow=chain +mesh (Standard)
Conveyor height	900± 20mm
Conveyor speed range	300~2000mm/min